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TC1223/TC1224
50mA and 100mA CMOS LDOs with Shutdown
Features
* Extremely Low Ground Current for Longer Battery Life * Very Low Dropout Voltage * Choice of 50mA and 100mA Output (TC1223, TC1224, Respectively) * High Output Voltage Accuracy * Standard or Custom Output Voltages * Power Saving Shutdown Mode * Over Current and Over Temperature Protection * Space-Saving 5-Pin SOT-23A Package * Pin Compatible Upgrades for Bipolar Regulators
General Description
The TC1223 and TC1224 are high accuracy (typically 0.5%) CMOS upgrades for older (bipolar) low dropout regulators such as the LP2980. Designed specifically for battery-operated systems, the devices' CMOS construction eliminates wasted ground current, significantly extending battery life. Total supply current is typically 50A at full load (20 to 60 times lower than in bipolar regulators). The devices' key features include ultra low noise operation; very low dropout voltage (typically 85mV, TC1223 and 180mV, TC1224 at full load) and fast response to step changes in load. Supply current is reduced to 0.5A (max) and VOUT falls to zero when the shutdown input is low. The devices incorporate both over temperature and over current protection. The TC1223 and TC1224 are stable with an output capacitor of only 1F and have a maximum output current of 50mA and 100mA respectively. For higher output current versions, please see the TC1107, TC1108 and TC1173 (IOUT = 300mA) data sheets.
Applications
* * * * * * * Battery Operated Systems Portable Computers Medical Instruments Instrumentation Cellular/GSM/PHS Phones Linear Post-Regulators for SMPS Pagers
Typical Application
VIN 1 VIN VOUT 5 + 1F VOUT
Device Selection Table
Part Number TC1223-xxVCT TC1224-XXVCT Package 5-Pin SOT-23A 5-Pin SOT-23A Junction Temp. Range -40C to +125C -40C to +125C
TC1223 TC1224
2 GND
NOTE: xx indicates output voltages Available Output Voltages: 2.5, 2.7, 2.8, 2.85, 3.0, 3.3, 3.6, 4.0, 5.0. Other output voltages are available. Please contact Microchip Technology Inc. for details.
3 SHDN NC 4
Package Type
5-Pin SOT-23A
VOUT 5 NC 4
Shutdown Control (from Power Control Logic)
TC1223 TC1224
1 VIN 2 GND 3 SHDN
NOTE: 5-Pin SOT-23A is equivalent to the EIAJ (SC-74A)
2002 Microchip Technology Inc.
DS21368B-page 1
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TC1223/TC1224
1.0 ELECTRICAL SPECIFICATIONS
Absolute Maximum Ratings*
Input Voltage .........................................................6.5V Output Voltage........................... (-0.3V) to (VIN + 0.3V) Power Dissipation.............................. Internally Limited Maximum Voltage on Any Pin ........ VIN +0.3V to -0.3V Operating Temperature Range...... -40C < TJ < 125C Storage Temperature.......................... -65C to +150C
Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability.
TC1223/TC1224 ELECTRICAL SPECIFICATIONS
Electrical Characteristics: VIN = VOUT + 1V, IL = 100A, CL = 3.3F, SHDN > VIH , TA = 25C, unless otherwise noted. Boldface type specifications apply for junction temperatures of -40C to +125C. Symbol VIN IOUTMAX VOUT TCVOUT VOUT/VIN VOUT/VOUT VIN-VOUT Parameter Input Operating Voltage Maximum Output Current Output Voltage VOUT Temperature Coefficient Line Regulation Load Regulation Dropout Voltage Min 2.7 50 100 VR - 2.5% -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- 45 -- Typ -- -- -- VR 0.5% 20 40 0.05 0.5 2 65 85 180 50 0.05 64 300 0.04 160 10 260 -- -- Max 6.0 -- -- VR + 2.5% -- -- 0.35 2 -- -- 120 250 80 0.5 -- 450 -- -- -- -- -- 15 Units V mA V ppm/C % % mV Test Conditions Note 8 TC1223 TC1224 Note 1 Note 2 (VR + 1V) VIN 6V IL = 0.1mA to IOUTMAX (Note 3) IL = 100A IL = 20mA IL = 50mA IL = 100mA (Note 4) SHDN = VIH, IL = 0 (Note 7) SHDN = 0V FRE 1kHz VOUT = 0V Notes 5, 6
TC1224 IIN IINSD PSRR IOUTSC VOUT/PD TSD TSD eN SHDN Input VIH VIL
Note 1: 2: 3:
Supply Current Shutdown Supply Current Power Supply Rejection Ratio Output Short Circuit Current Thermal Regulation Thermal Shutdown Die Temperature Thermal Shutdown Hysteresis Output Noise SHDN Input High Threshold SHDN Input Low Threshold
A A dB mA V/W C C nV/Hz %VIN %VIN
IL = IOUTMAX VIN = 2.5V to 6.5V VIN = 2.5V to 6.5V
4: 5: 6:
7: 8:
VR is the regulator output voltage setting. For example: VR = 2.5V, 2.7V, 2.85V, 3.0V, 3.3V, 3.6V, 4.0V, 5.0V. TC VOUT = (VOUTMAX - VOUTMIN) x 10 6 VOUT x T Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range from 0.1mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation specification. Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value at a 1V differential. Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 msec. The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction-to-air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation causes the device to initiate thermal shutdown. Please see Section 4.0 Thermal Considerations for more details. Apply for Junction Temperatures of -40C to +85C. The minimum VIN has to justify the conditions: VIN VR + VDROPOUT and VIN 2.7V for IL = 0.1mA to I OUTMAX.
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DS21368B-page 2
2002 Microchip Technology Inc.
TC1223/TC1224
2.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1.
TABLE 2-1:
Pin No. (5-Pin SOT-23A) 1 2 3
PIN FUNCTION TABLE
Symbol VIN GND SHDN Unregulated supply input. Ground terminal. Shutdown control input. The regulator is fully enabled when a logic high is applied to this input. The regulator enters shutdown when a logic low is applied to this input. During shutdown, output voltage falls to zero and supply current is reduced to 0.5A (max). No connect. Regulated voltage output. Description
4 5
NC VOUT
2002 Microchip Technology Inc.
DS21368B-page 3
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TC1223/TC1224
3.0 DETAILED DESCRIPTION
3.1 Output Capacitor
The TC1223 and TC1224 are precision fixed output voltage regulators. Unlike bipolar regulators, the TC1223 and TC1224's supply current does not increase with load current. In addition, VOUT remains stable and within regulation over the entire 0mA to IOUTMAX operating load current range, (an important consideration in RTC and CMOS RAM battery back-up applications). Figure 3-1 shows a typical application circuit. The regulator is enabled any time the shutdown input (SHDN) is at or above VIH, and shutdown (disabled) when SHDN is at or below VIL. SHDN may be controlled by a CMOS logic gate, or I/O port of a microcontroller. If the SHDN input is not required, it should be connected directly to the input supply. While in shutdown, supply current decreases to 0.05A (typical) and VOUT falls to zero volts. A 1F (min) capacitor from VOUT to ground is recommended. The output capacitor should have an effective series resistance greater than 0.1 and less than 5.0, and a resonant frequency above 1MHz. A 1F capacitor should be connected from VIN to GND if there is more than 10 inches of wire between the regulator and the AC filter capacitor, or if a battery is used as the power source. Aluminum electrolytic or tantalum capacitor types can be used. (Since many aluminum electrolytic capacitors freeze at approximately -30C, solid tantalums are recommended for applications operating below -25C.) When operating from sources other than batteries, supply-noise rejection and transient response can be improved by increasing the value of the input and output capacitors and employing passive filtering techniques.
FIGURE 3-1:
TYPICAL APPLICATION CIRCUIT
VIN VOUT VOUT + 1F
+ 1F + Battery
TC1223 TC1224
GND
SHDN
NC
Shutdown Control (to CMOS Logic or Tie to VIN if unused)
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DS21368B-page 4
2002 Microchip Technology Inc.
TC1223/TC1224
4.0
4.1
THERMAL CONSIDERATIONS
Thermal Shutdown
Equation 4-1 can be used in conjunction with Equation 4-2 to ensure regulator thermal operation is within limits. For example: Given: VINMAX = 3.0V 10% VOUTMIN = 2.7V - 2.5% ILOADMAX = 40mA TJMAX TAMAX = 125C = 55C
Integrated thermal protection circuitry shuts the regulator off when die temperature exceeds 160C. The regulator remains off until the die temperature drops to approximately 150C.
4.2
Power Dissipation
The amount of power the regulator dissipates is primarily a function of input and output voltage, and output current. The following equation is used to calculate worst case actual power dissipation:
Find: 1. Actual power dissipation 2. Maximum allowable dissipation Actual power dissipation: PD (VINMAX - VOUTMIN)ILOADMAX = [(3.0 x 1.1) - (2.7 x .975)]40 x 10-3 = 26.7mW Maximum allowable power dissipation:
EQUATION 4-1:
PD (VINMAX - V OUTMIN)ILOADMAX Where: PD VINMAX VOUTMIN ILOADMAX = Worst case actual power dissipation = Maximum voltage on VIN = Minimum regulator output voltage = Maximum output (load) current
The maximum allowable power dissipation (Equation 4-2) is a function of the maximum ambient temperature (TAMAX), the maximum allowable die temperature (TJMAX) and the thermal resistance from junction-to-air (JA). The 5-Pin SOT-23A package has a JA of approximately 220C/Watt.
PDMAX = (TJMAX - TAMAX) JA = (125 - 55) 220 = 318mW In this example, the TC1223 dissipates a maximum of 26.7mW; below the allowable limit of 318mW. In a similar manner, Equation 4-1 and Equation 4-2 can be used to calculate maximum current and/or input voltage limits.
EQUATION 4-2:
PDMAX = (TJMAX - TAMAX) JA Where all terms are previously defined.
4.3
Layout Considerations
The primary path of heat conduction out of the package is via the package leads. Therefore, layouts having a ground plane, wide traces at the pads, and wide power supply bus lines combine to lower JA and therefore increase the maximum allowable power dissipation limit.
2002 Microchip Technology Inc.
DS21368B-page 5
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TC1223/TC1224
5.0
Note:
TYPICAL CHARACTERISTICS
(Unless Otherwise Specified, All Parts Are Measured At Temperature = 25C) The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
0.020 0.018
Dropout Voltage vs. Temperature (VOUT = 3.3V) ILOAD = 10mA
0.100 0.090
DROPOUT VOLTAGE (V)
Dropout Voltage vs. Temperature (VOUT = 3.3V) ILOAD = 50mA
DROPOUT VOLTAGE (V)
0.016 0.014 0.012 0.010 0.008 0.006 0.004 0.002 0.000 -40 -20 0 20 50 TEMPERATURE (C) 70 125
0.080 0.070 0.060 0.050 0.040 0.030 0.020 0.010 0.000 -40 -20 0 20 50 TEMPERATURE (C) 70 125
CIN = 1F COUT = 1F
CIN = 1F COUT = 1F
0.200 0.180
DROPOUT VOLTAGE (V)
Dropout Voltage vs. Temperature (VOUT = 3.3V) ILOAD = 100mA
GND CURRENT (A)
90 80 70 60 50 40 30 20 10 0
Ground Current vs. VIN (VOUT = 3.3V) ILOAD = 10mA
0.160 0.140 0.120 0.100 0.080 0.060 0.040 0.020 0.000 -40 -20 0 20 50 70 125
CIN = 1F COUT = 1F
CIN = 1F COUT = 1F
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 6.5 7 7.5 VIN (V)
TEMPERATURE (C)
90 80
Ground Current vs. VIN (VOUT = 3.3V) ILOAD = 100mA
3.5
VOUT vs. VIN (VOUT = 3.3V) ILOAD = 0
3 2.5
GND CURRENT (A)
70
VOUT (V)
60 50 40 30 20 10 0
2 1.5 1
CIN = 1F COUT = 1F
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 6.5 7 7.5
0.5 0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5
CIN = 1F COUT = 1F
5.5 6 6.5 7
VIN (V)
VIN (V)
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DS21368B-page 6
2002 Microchip Technology Inc.
TC1223/TC1224
5.0 TYPICAL CHARACTERISTICS (CONTINUED)
(Unless Otherwise Specified, All Parts Are Measured At Temperature = 25C)
3.5 3.0 2.5 VOUT (V) 2.0 1.5 1.0 0.5 0.0
0
VOUT vs. VIN (VOUT = 3.3V) ILOAD = 100mA
3.320 3.315 3.310 3.305
Output Voltage vs. Temperature (VOUT = 3.3V) ILOAD = 10mA
VOUT (V)
3.300 3.295 3.290 3.285
CIN = 1F COUT = 1F
0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 6.5 7 VIN (V)
3.280 3.275 -40
CIN = 1F COUT = 1F VIN = 4.3V
-20 -10 0 20 40 85 125
TEMPERATURE (C)
5.025 5.020 5.015
Output Voltage vs. Temperature (VOUT = 5V) ILOAD = 10mA
70 60
Temperature vs. Quiescent Current (VOUT = 5V) ILOAD = 10mA
VOUT (V)
5.010 5.005 5.000 4.995 4.990 4.985
GND CURRENT (A)
50 40 30 20 10 0 -40 -20 -10 0 20 40 TEMPERATURE (C) 85 125
VIN = 6V CIN = 1F COUT = 1F
-40 -20 -10 0 20 40 85 125
TEMPERATURE (C)
VIN = 6V CIN = 1F COUT = 1F
Output Noise vs. Frequency 10.0 1000 RLOAD = 50 COUT = 1F CIN = 1F COUT ESR ()
Stability Region vs. Load Current COUT = 1F to 10F -30 -35 -40 100 10 1 Stable Region PSRR (dB) -45 -50 -55 -60 -65 0.1 -70 -75
Power Supply Rejection Ratio IOUT = 10mA VINDC = 4V VINAC = 100mVp-p VOUT = 3V CIN = 0 COUT = 1F
NOISE (V/Hz)
1.0
0.1
0.0 0.01K 0.1K
0.01 1K 10K 100K 1000K FREQUENCY (Hz) 0 10 20 30 40 50 60 70 80 90 100 LOAD CURRENT (mA)
-80 0.01K 0.1K
1K 10K 100K 1000K FREQUENCY (Hz)
2002 Microchip Technology Inc.
DS21368B-page 7
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TC1223/TC1224
5.0 TYPICAL CHARACTERISTICS (CONTINUED)
Measure Rise Time of 3.3V LDO Conditions: CIN = 1F, COUT = 1F, ILOAD = 100mA, VIN = 4.3V, Temp = 25C, Fall Time = 184S Measure Fall Time of 3.3V LDO Conditions: CIN = 1F, COUT = 1F, ILOAD = 100mA, VIN = 4.3V, Temp = 25C, Fall Time = 52S
VSHDN
VSHDN
VOUT
VOUT
Measure Rise Time of 5.0V LDO Conditions: CIN = 1F, COUT = 1F, ILOAD = 100mA, VIN = 6V, Temp = 25C, Fall Time = 192S
Measure Fall Time of 5.0V LDO Conditions: CIN = 1F, COUT = 1F, ILOAD = 100mA, VIN = 6V, Temp = 25C, Fall Time = 88S
VSHDN
VSHDN
VOUT
VOUT
Thermal Shutdown Response of 5.0V LDO Conditions: VIN = 6V, CIN = 0F, COUT = 1F
VOUT
ILOAD was increased until temperature of die reached about 160C, at which time integrated thermal protection circuitry shuts the regulator off when die temperature exceeds approximately 160C. The regulator remains off until die temperature drops to approximately 150C.
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DS21368B-page 8
2002 Microchip Technology Inc.
TC1223/TC1224
6.0
6.1
PACKAGING INFORMATION
Package Marking Information
"1" & "2" = part number code + temperature range and voltage (V) 2.5 2.7 2.8 2.85 3.0 3.3 3.6 4.0 5.0 TC1223 Code L1 L2 LZ L8 L3 L5 L9 L0 L7 TC1224 Code M1 M2 MZ M8 M3 M5 M9 M0 M7
"3" represents year and quarter code "4" represents lot ID number
6.2
Taping Form
Component Taping Orientation for 5-Pin SOT-23A (EIAJ SC-74A) Devices
User Direction of Feed
Device Marking
W
PIN 1
P Standard Reel Component Orientation TR Suffix Device (Mark Right Side Up)
Carrier Tape, Number of Components Per Reel and Reel Size
Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size
5-Pin SOT-23A
8 mm
4 mm
3000
7 in
2002 Microchip Technology Inc.
DS21368B-page 9
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TC1223/TC1224
6.3 Package Dimensions
SOT-23A-5
.075 (1.90) REF.
.122 (3.10) .098 (2.50) .020 (0.50) .012 (0.30) PIN 1 .122 (3.10) .106 (2.70) .057 (1.45) .035 (0.90) .006 (0.15) .000 (0.00)
.071 (1.80) .059 (1.50)
.037 (0.95) REF.
10 MAX. .024 (0.60) .004 (0.10)
.010 (0.25) .004 (0.09)
Dimensions: inches (mm)
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DS21368B-page 10
2002 Microchip Technology Inc.
TC1223/TC1224
SALES AND SUPPORT
Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. 2. 3. Your local Microchip sales office The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. New Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
2002 Microchip Technology Inc.
DS21368B-page 11
TC1223/TC1224
NOTES:
DS21368B-page 12
2002 Microchip Technology Inc.
TC1223/TC1224
Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip's products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property rights.
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2002 Microchip Technology Inc.
DS21368B-page 13
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WORLDWIDE SALES AND SERVICE
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05/01/02
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DS21368B-page 14
2002 Microchip Technology Inc.
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